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SPL 225

Download  Technical Data  Sheet                                                                                   

PRODUCT

 SPL  225

 

CHEMICAL NAME &

STRUCTURE

Phenol Formaldehyde resin in powder form, containing Hexamine as hardner.

SPECIFICATIONS

 

Properties

 

Units

 

Specification

Appearance

 

--

Free flowing powder

 

Melting Point

°C

90 – 100

Pallet Flow @ 125°C

 

mm

20 – 30

Hexamine Content  

%

8 - 10                  

Hot Plate Cure Time @ 160°C  

secs

30 – 40

Ash content

%

5 max.

Sieve Analysis (-200#)

%

98

 

 

Storage and Handling:

SPL 225 Resin is stable at normal storage condition. However  we recommend to keep it in cool and dry place for best results.

 

Shelf – Life Data:

6 months at room temperature in original packed condition

Applications:

SPL 225 Resin is recommended as Bonding agent in Grinding Wheels.

 


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