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SPL 228

Download  Technical Data  Sheet                                                                                   

PRODUCT

 SPL  228

 

CHEMICAL NAME &

STRUCTURE

 

Phenol Formaldehyde resin in powder form, containing Hexamine as hardner.

SPECIFICATIONS

 

Properties

 

Units

 

Specification

Appearance

 

--

Free flowing powder

 

Melting Point

°C

80 – 90

Pallet Flow @ 125°C

 

mm

35 – 50

Hexamine Content  

 

%

8 – 10                 

Hot Plate Cure Time @ 160°C  

secs

35 – 45

Sieve Analysis (-200#)

%

98

 

 

Storage and Handling:

SPL 228 Resin is stable at normal storage condition. However  we recommend to keep it in cool and dry place for best results.

 

Shelf -Life Data: 

6 months  at room temperature in original packed condition

 

APPLICATIONS:

 

SPL 228 Resin is recommended as Bonding agent in  Friction lining and General Purpose applications.

 


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