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Title: Stretching Polychloroprene Supplies in Solvent-Borne Adhesives

Abstract:

A presentation from the Adhesive and Sealants Council Fall Convention in Nashville, TN on October 17, 2006, presented by James J. Lamb and Timothy E. Banach, PhD. Several adhesive compositions that extend the quantity of adhesive that can be made from a limited supply of polychloroprene are compared. Phenolic resin blends and loads are detailed. Test results given include Dynamic Peel, Shear Adhesion, Dead Load under heated conditions, and the relationship between solids and viscosity.

Conclusions:
Higher than typical resin loads can be used to extend the available supply of PCR to make 1/3 more adhesive without sacrificing performance.
High solids content adhesives can be prepared at acceptable viscosity by increasing resin load.
Low viscosity adhesives can be prepared for spray applications at constant solids content by replacing polychloroprene with phenolic resin.
Properties of adhesives can be enhanced by choice and load of resin.

 



Title: Review of Phenolic Resins for use in Contact Cements

Abstract: A presentation from the World Adhesive Conference in Beijing, China on October 20-22, 2004, presented by James J. Lamb, Global Business Manager of the Performance Resins Division.

Addresses performance advantages that various grades of commercial phenolic resins impart; highlighted is the impact on adhesives that are made when the structure of the phenolic resin is modified or various additives are added. Includes commonly described physical properties of phenolic resins, and what these different properties mean to the adhesive manufacturer. Performance tests include Open Time, Shear Adhesion, T-Peel Values, and Adhesive Failure Temperatures.


Title: Phenolic Resins for Curing Elastomers

Abstract:

Paper presented at a pharmaceutical rubber seminar in Xiamen, CN, November 2003, presented by Jim Lamb.

The chemistry and method of using phenolic resins as the curative for rubber, and specifically pharmaceutical rubber compounds, is discussed in detail.The curing profiles for butyl rubber compounds are compared, and the stress, strain and hardness of promobutyl rubber compounds are described.  Features and benefits of phenolic resin curing are also provided.



 

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